Research On A Novel Three-dimensional Opti-electronic Hybrid Interconnection Network For High Performance Computer

Nowadays,therearetwoeffectiveapproaches: improvementofthesinglecomputingnodes and the advances and optimization of interconnect networks to boost high perfor-mance computer’s performance. However, with the rapid development of integrated cir-cuit technology, the high-speed processor has more and more obvious quantum effects. Asingle processor performance has met great challenge, so the performance improvementof the whole system is mainly integrating more and more processors. Traditional elec-trical interconnection network, because of its low bandwidth, high delay and low inter-connect density, becomes one of the constraints of high-performance computers’ furtherimprovement. Light waves, as information carriers, have many incomparable advantagesto dielectric: high space-time bandwidth, high degree of parallelism, interference-freetransmission, low power consumption, and so on.However, in the current technical conditions, there is no effective optical buffer andthe available optical processor. For general packet-switch optical interconnection system,the nodes in the network have to convert optical signals to electrical signals for routingand caching, which will introduce additional transmission delay. It is an effective and ef-ficient solution to use Opti-electronic hybrid interconnection network which BOIN intro-duces. In this solution, control information and data information of packets are separatedand transported respectively. Real data packets are transported by electric, at meantime,control packets by optic. Through this method, we can control transporting direction ofoptical data and avoid optic-electric conversions. However, this two-dimensional inter-connection structure of BOIN constrains the improvement of the network performance.When the network size is relatively great, these constraints are more apparently. Aimingat the defeats of optic technology and BOIN’s two-dimensional structure, we focused onthe study of three-dimensional optical-electrical hybrid interconnection networks. A newoptical interconnection network model named three-dimensional optical interconnectionnetwork(TDOIN)isproposed. WealsostudyTDOIN’sroutingalgorithm, andatthesametime, analyze the performance of TDOIN by simulation experiments and mathematicalmodel. The main contributions of this thesis are:1. Aiming at the problem of optical interconnection network and low dimension of BOIN, a novel three-dimensional optical-electrical hybrid interconnection networkis put forward. In this thesis, we study TDOIN’s topology and packets collision’sgeneration and avoidance, put forward a XY-first routing algorithm and analyze itsnetwork properties.2. BasedonOMNeT++platform, wedeviseaTDOINnetworksimulator, andcarryonsome simulation experiments by this simulator. We compare TDOIN and BOIN atnetwork performance. As a consequence, TDOIN has low delay and high through.3. In order to accurately characterize and evaluate the performance of TDOIN net-work, this thesis uses mathematical probability theory tools to analyze the charac-teristics of network traffic in all directions link, and establish a mathematical modelbased on the steady-state conditions. TDOIN’s Network performance under differ-ent network size and different network load can be gained by this model.Inthisthesisforthecommunication’sneedsofhighperformancecomputers,wehaveconducted a comprehensive study of optical interconnection networks, proposed a three-dimensional optical-electrical hybrid interconnection network and its routing algorithm,stimulatedexperimentsandprovidedmathematicalmodels. Theresultsoftheabovestud-ies offer an effective solution for the practical problems encountered in the high speedinterconnect networks, and for high-dimensional interconnect network design has sometheoretical significance and application value.