Response Analysis For High Power LED Under Stamping And Impact Load

In this paper, the response analysis for high-power LED module under stamping andimpact load is conducted with simplified theoretical analysis, experimental testing andnumerical simulation.The precise leadframe LED module is drawn with the help of3D microscopy. The microstamping processing is simulated by nonlinear FEA software ABAQUS, which focuses ondeflection of lens in the process of micro stamping. The simulation results show that the lensof LED module has a small deflection caused by the gap in the asymmetric stamping process.The light intensity distribution and the illumination distribution of lead frame LED moduleare compared in normal situation and angle deflection situation of lens. The maximum lightintensity is no longer in90°vertical to the emitting surface. The light flux also decreases withthe increase of the deflection angle.A self-made microelectronics drop impact tester consists of two parts: hardware andsoftware. The hardware part includes base, frame, rails, bumper blocks, fixtures,electromagnet, test bench, sensors, amplifiers, A/O card and computer. The software interfaceof impact drop tester is based on Advantech1712L data acquisition card. Data acquisitionplatform is based on virtual instrument graphical programming software LABVIEW, whichcan effectively accomplish high-speed data acquisition, real-time graphical display and storeimpact data to a text file.Reliability performances of high power LED module subjected to drop test conditionsare evaluated experimentally. Good reproducibility dynamic parameters of impact force-time,acceleration-time are recorded for evaluating the impact response through the signalprocessing. In addition, a theoretical analysis of the impact dynamic progress is conduced,which shows the self-made drop tester is relatively precise by comparing the theoretical andexperimental results. The major failure modes of LED module include lens fall off and crackformation in the impact experiment.The numerical simulation is conducted by nonlinear FEA software ABAQUS for highpower LED drop impact process f under different drop angle conditions. Because the dropimpact is a transient dynamic process, the constitutive relations of solder material under highstrain rate are taken into consideration. The purpose of numerical simulation is to obtain thedistribution of local stress and deformation under drop impact process, which is significant for comprehensive and in-depth understanding for high-power LED module drop impactresponse.