A Fault-Tolerant Design For TSV And Crossbar In3D NoC

With the development of the integrated circuit manufacturing process and thereducing feature size of transistors, there will be hundreds of IP cores integrated ona single chip. When the increase in the number of IP cores on the chip and thehomogeneous and heterogeneous module widely combination, the bus-sharedSystem-on-Chip communication architecture will face many issues, such as thescalability, communication efficiency, power consumption and area cost problemsand so on. To solve these problems, researchers have proposed a newpacket-switching-based interconnected architecture, Network-on-Chip (NoC). Ithas better performance in scalability and predictability compared with thebus-based structure. However, the Interconnect lines are still affecting the VLSI’sperformance and power consumption of the bottleneck. Two-dimensional packagingtechnology can’t meet the need of the high-density assembly on chip, whichpromotes the three dimensional packaging technology.3D NoC can improve thesystem performance, and reduce power consumption.This thesis introduces the basic knowledge of3D-NoC，and focuses on thestudy of3D-Mesh NoC communication, and proposes the solution to the problem ofTSV (Through Silicon Via) failures and TSV router’s delay and high powerconsumption.The research work of this thesis is as follows:(1) This thesis introduces the background and purpose, key issues in researchand current research situation at home and abroad of3D NoC. Besides,3D-meshNoC topological structure, the switching technique fault-tolerant approach andsome hot issues in3D-NoC research are introduced in this thesis.(2) On the3D NoC, one of the two groups of unidirectional TSVs in theadjacent routers between the layers is fault, the data would not be transmittedthrough this channel. A Fault-tolerant design of a cluster-based3D NoC usingredundant bidirectional TSVs is presented in this thesis. In order to transmit datacorrectly, a group of extra bidirectional TSVs which can be dynamically configuredbetween the unidirectional TSVs added to replace either of them, and tolerate thefault for transmitting data normally. What’s more, in the trouble-free case, thebidirectional TSVs can be configured to help transmit data packets to achieve high-speed data transmission. Experimental results demonstrate that the packettransmission latency can be reduced sharply and the system reliability is improved.(3) In order to solve the problems of latency and power consumption, thisthesis designs the TSV router as the dual crossbar architecture, called the mastercrossbar and the slave crossbar. Departing the router’s input port into twoindependent sub-ports, and setting the port which connected to the master crossbaras bufferless, the other one has buffer. The data transmission choose the mastercrossbar preferentially, the alternative crossbar will be used when the master isbusy. As a result, the transmission delay and power consumption will be reduced.At the same time, the dual crossbar can achieve fault-tolerant about crossbar.