| With the rapid development in the field of optical technology, the quality of the optical elements requires higher precision. Not only requires high surface quality, but also requires no subsurface damage. The subsurface damages of optical elements that produced in grinding and polishing processes will directly influence the imaging quality of optical systems, laser-induced damage threshold of optical elements, secular stability. Thus effective measurement of the subsurface damages of optical elements that produced in grinding and polishing processes is the precondition in determining the removal amount of material in subsequent processes and improving the subsurface quality. In this paper, production mechanism of subsurface damages grinding and polishing processes was summarized. On the basis of the production mechanism, subsurface damage depth of ground and polished K9glass was measured by HF constant etch rate method and HF phased etch observation method. Furthermore, the factors that affecting subsurface damages of ground the optical elements are explored by experiments combined the prediction model of optical materials subsurface damage depth. The main research contents are as follows:1. The mechanical properties of optical materials and the production mechanism of subsurface damage in grinding and polishing processes are summarized, which provide theoretical basis for the subsurface damage measurement.2. Based on the Constancy of HF chemical etch rate method, a HF phased etch observation method is developed and applied to the subsurface damages measurement of ground optical elements.3. Compared the experiment results of metallographic microscope, SEM and AFM. Improved the HF phased etch observation method to measure the subsurface damages of polished optical elements effectively.4. Discussed the impact of parameters on the optical elements grinding subsurface damages. Proposed a method which could reduce the subsurface damages. |
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