A Study On Quality Improvement Of PCBA Process In H Company

Residual Current Circuit Breaker with Overload protection (RCBO) is used to protectdevice and people in case of overload or short circuit.and leakage happen in the line,currently, there are two kinds of Electronic RCBO sales to Europe,middle east and HKmarket in H company, the forecast sales quantity is about1300K pcs in2013.total turnover isabout175million RMB. PCBA is one of the most important subset of RCBO, it is makesense to do analysis on the PCBA manufacture process.. currently, there is only one PCBAmanufacture line in H company to provide PCBA for the assembly line. PCBA productionprocess is use of SMT techniques, so a large part of the chip componet is use to improveefficiency,, it is very difficult to guarantee0defect. we find there some component crackproblem during the PCBA manufacture process,this kind of crack defect is not easy to detectby visual inspection and also by FCT tester.if the defective PCBA was assembly into thefinished goods, it is not only impact the product reliability, but also will make the productloss function. H group had recalled one product due to the PCBA is not working and onepeople was died when the earth leakage happen,and total lose2million Eur.In this paper, theory and practice research methods, theoretical analysis will becombined with the actual business cases. first reviews the quality control technologyresearch status and process quality control theories and methods, and focus on the chipcomponent crack problem. some quality tools have been used for this problem solving, suchas Pareto analyz,fish bone, PFMEA, GR&R,, capability sutdy, SPC. Do deep analyze forthe main causes,Test pin of FCT tester not properly setting, Cpk of V-cut dimensionlower than requiremenet, the layout of the PCB panel is not good,during cutting the pin ofTHT component also will cause the capacitor crack problem. improvement actions weretaken to solve this problem, the target was almost achieved after the implementation of theimprovement action, the defect rate is improved from2.5%to0.04%..by the end of theanalyze, use SPC tool to control the PCB V-cut process.