Dynamic Simulation And Trajectory Optimization Of Wafer Handling Robot Of Large Scale Ultra-precision Grinding Machine

Integrated circuit (IC) manufacturing has become the basis of world economy and ICequipments are the indispensable support of IC manufacturing. Large scale ultra-precisiongrinding machine is one of the important equipment in IC manufacturing, and thewafer-handling robot is the core of its transmission system, which is used to position andtransfer wafers during the course of fabrication efficiently and reliably. The working propertyof the wafer-handling robot has direct effect on the productive efficiency and manufacturingquality, and shows the automation and reliability of the total processing system. So theresearch of wafer-handling robot is important to the development of IC manufacturing.According to the demand of the high efficiency, high reliability and high stability, anddynamic simulation and trajectory optimization of wafer-handling robot of large scaleultra-precision grinding machine are researched deeply.Firstly, based on the classification, present research situation and development of thewafer-handling robot at home and abroad, by comparing the performance of the R-θ type andSCARA. Finally, chosen the R-θ robot for the research object overall plan from reality, andaccording to the movement characteristics of wafer-handling robot (radial linear stretching),choose the planetary gear train which drive by belt for model of the wafer-handling robot arm.Then, according to operating principles of planetary gear train, established the kinematicmodel of the radial linear concertina motion of wafer-handling robot arm, and analysed forkinematics and dynamics. Provides theory basis for dynamic simulation and trajectoryoptimization of wafer-handling robot.Thirdly, considered Microsoft Visual Studio2008as the development environment,developed the dynamic simulation system by Pro/toolkit, in this environment accomplishedthe dynamic simulation of wafer-handling robot, and detecting the movement of the robot andinterference at any time clearly.Finally, based on the simulation results, researched the time-optimal trajectory planningof wafer-handling robot, and facing to special trajectory mechanical arm, time-optimaltrajectory planning method, which consider the path limits, the velocity limits, and theacceleration limits, is proposed. Then this method is applied to the design robot and the firstarm velocity curve is obtained, and time-optimal trajectory optimizing of wafer-handlingrobot was achieved.