Researh On Making Semi-flex PCB Based On Genesis And Minitab Software

At present, miniaturization and integration are the trends of the electronic product,while the encapsulation technology is also put forward strict requirements. Thethree-dimensional encapsulation needs less area. And the rigid-flex PCB, which can beapplied to three-dimensional encapsulation, developed fast in recent years. With thenew materials and technology being developed in printed circuit board technology, aspecial printed circuit board with rigid-flex structure, semi-flex PCB, has been paidmuch attention to. The semi-flex PCB technology changes the traditional rigid-flex PCBproduction method. It does not need the expensive flexible material. The production ofprinted circuit board with part flexible function is based on rigid multilayer PCBtechnology by using normal rigid material. The flexibility of semi-flex PCB has a largegap with the traditional rigid-flex PCB. But it can be used in electronic products whichneed a limited number of bending only in the installation, rework and repair process. Inaddition, using semi-flex PCB can provide better reliability and more stable electricalperformance, while significantly reducing the cost of material and processing. So, thesemi-flex PCB technology is worthy to develop.This study focused on developing a method of producing the semi-flex PCB byusing cushion buried in the portion of multilayer PCB. By using of computer-aidedmanufacturing software Genesis2000, the design data of semi-flex PCB transformedinto equipment identifiable data, such as film date, drilling date and milling date,according to the processing capability in factory. Further more, the quality managementstatistics software Minitab15was using in semi-flex PCB production process toinvestigate the complex process capability index in some important process. At thesame time, the Taguchi design function of Minitab15was using for orthogonalexperiment to optimize the key process parameters. The length of resin flow in slotposition of semi-flex PCB was controlled well. And the flexibility of solder mask madefrom soft printing ink was improved. In this study, the180degree bend test was carryout to evaluate the flexibility of different types of rigid material, and we found out the most suitable rigid material for semi-flex PCB. The polyimide cover layer was tried touse in the flexible area protection process instead of soft printing ink solder mask. Andthe180degree bend test, thermal stress test, thermal shock test and salt spray test werecarried out to assess the semi-flex PCB production reliability. The Minitab15was alsoapplied to analyze the experimental data in some tests.By using of Genesis2000and Minitab15in the research process of Semi-flex PCBtechnology, the study work went more scientific and more efficient. The study taskswere performed well, and the test results will have a function of directing thecontinuous improvements of manufacturing process capability.