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Study On High-performance Amplifier IP For Thermal MEMS Interface Circuit

Posted on:2014-02-04Degree:MasterType:Thesis
Country:ChinaCandidate:D X SongFull Text:PDF
GTID:2248330395492169Subject:Measuring and Testing Technology and Instruments
Abstract/Summary:PDF Full Text Request
Thermal MEMS sensor is widely used in medical, industrial control, environmentalmonitoring and military field, It has become a hot research object. Using monolithicintegrated MEMS thecnology which is fully compatible with the CMOS process has obviousadvantages in many aspects. Integrated, miniaturized sensor system is becoming thedevelopment trend. First of all,make use of the mature CMOS process can carry out largequantities production, the process is simple and low cost. Secondly, integration with IC signalprocessing circuit can achieve the miniaturization of the entire sensor system and versatility,improve the quality of the output signal effectively. Thirdly, compared with the discretedevices or hybrid devices,the power consumption of monolithically integrated sensor issmaller and more reliable.Therefor, in recent years, the integrated mode which is fullycompatible with the CMOS technology has become the main target of many researchorganizations.The research content of this paper is to design high performance general preamplifier forthe interface circuit of thermal MEMS devices,and IP (Intellectual Property) library werestudied,making a preliminary preparation for the establishment of thermal MEMS interfacecircuits IP library. Because of there are many kinds of thermosensitive MEMS devices, thispaper make a detailed discussion only focuses on monolithic integrated thermopile infraredsensor output signal characteristics as well as the interface circuit. By extracting the typicaldevice parameters of thermal MEMS and the characteristics of the common pre-processingcircuit module,designed the pre-amplifier.This paper designed three different structures with different performance opamps,simulation the circuit and design layout with Cadence software based on the CSMC0.5μm CMOS standard process library.what’s more, the circuits have been manufactured byCSMC foundry0.5μm CMOS process.The chip have been packaged in the fifty-eighth Research Institute of China Electronics Techenology Group. Through the test, theperformances of operational amplifiers are good, can be used to create a reusable and reliableunit.The library will be applied in MEMS design service platform in the public, providereliable technical support for follow-up personnel who engaged in the research anddevelopment of the device, provide support for some enterprises which need technical service,saving the cost of the technology, and effectively improve the thermal reliability of MEMSdevices.
Keywords/Search Tags:thermal MEMS, monolithic integration, preamplifier, IP
PDF Full Text Request
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