Research Of GPON ONU Device Based On Opto-electronic Hybrid Integration

The optical communication is developing vigorously. And GPON and EPON becomemainstream technologies of international access network technologies. GPON is muchmore superior than EPON in technology because of its high rate, high bandwidthutilization, long transmission distance, and rich interfaces. With the realization of FTTH,the amount of access users increases, but also raise a higher requirement of high rate andlow cost for ONU device at the same time. Optical integrated device is successfullydeveloped, which is promoted by the advancement of technics. Optoelectronic hybridintegrated device has many advantages, including small size, low cost, integratedmulti-function, good reliability, and completely satisfies market requirement for GPONONU device. The successful development of GPON ONU device based on optoelectronichybrid integration has an important guiding significance to the future photonic integrateddevice.In the Chapter1of this thesis, PON technology development is briefly introduced,and then the superiority of GPON technology is briefly demonstrated through comparingthe characteristics of GPON and EPON technology. And introduce the four stages and theresearches of the development of optical device in and out of country, and comparestrengths and weaknesses of each technology. Then in the Chapter2, the guided modeconditions of planar dielectric waveguide and bar waveguide are introduced with radialmethod and wave equation respectively, and the waveguide coupling conditions and theproduction technology of planar waveguide are outlined briefly. Chapter3focuses onoptoelectronic integrated device technology, including the surface mounted photonicstechnology, passive alignment technology and non-hermetic packaging technology.Respectively outline the advantages of surface mounted photonics technology, the methodof coupling alignment of fiber with waveguide and chip, and then carry through theoreticalanalysis and simulation. And finally briefly introduce glue in use and processcharacteristics of non-hermetic package. In Chapter4, outline the design, process and principle of laser chip, detector chip, body type filter, and then carry through theoreticalanalysis of integrated adiabatic coupler, including alignment error and influencing factors.Chapter5introduces the device packaging process and test parameters first, and then buildtest platform to test all parameters of device. The test results show that the optoelectronichybrid integrated device fully satisfies the technical requirements of GPON ONU device.