Printed Circuit Board Electroplating Conditions And Soft Hard Union Affiliated Process Design Software Development

Along with the development of PCB, application field of diversification, orientedto the light, thin, short, small direction of development has become the mainstream inPCB. At the same time from design direction of structure, high integration, high level,high precision grade, aperture smaller high aspect ratio will be the developmentdirection of PCB. Electroplating of emerge in an endless stream, but the realization ofelectroplating condition, process and parameters of design research is almost blank; theresearchers generally research orientation in electroplating line procedure of automaticcontrol, automatic adding control and liquid component stability research.Due to various manufacturers of equipment type, practical life, maintenance mode,the researchers could not develop a set of generic program. Therefore, according to themanufacturer’s own characteristics and process capability study the results of dataanalysis to develop a set of applicable to a single manufacturer of automation programdesign, according to the printed board itself characteristics and customer requirementsin the design of terminal design current conditions, electroplating production line anddon’t affiliated with thin copper process; the design information is reflected in theprocess card the production staff, just follow the process card information operation.This article started from etching--the process after plating, etching processcapability is studied through simulation experiment and data is analyzed by Minitab;collection of the plating line plating copper thickness data, through the data analysis iscalculated after each plating line plating efficiency; at the same time, through thesimulation experiment, grasping the electroplating line plates with different thickness,pore ratio the small holes and deep plating ability. Based on the above data, using VisualBasic language program written. Finally the simulation sample production andelectroplating, etching after the data collection and statistical analysis.The test results indicated that:(1) etching process capability is stable, can be incorporated into the program databaseoperations. (2) plating efficiency data through validation samples confirm the consistent, can beincorporated into the operation of the database.The software of Minitab certification sample data analysis confirmed, using theprogram is derived for the plating conditions as well as the accessory process， thedefects of etching process for plating related in control is less than1.5%, to meet thedemand.