The Study On Key Technologies Of Measurement Of Warpaging Deformation Of Chip Substrate Regard To Microstructure

The greater integration of microelectronic circuits,the smaller size of chip. The substrate warpage of chip is the great reason that effects chips’reliability on which we put attention in the poor condition.The chip substrate is composed by the multi-layer composite material and the coefficient of thermal expansion of each material is different, so it will become warping when it is in heat impact. In order to measure warpage of chip substrate, the paper studied the key technologies of measurements through the technology of shadow moire fringe and phase shift.First.the paper analyzed the deformation in the heating process by means of thermodynamic analysis and the classical theory of laminated,and analyzed thermal structural by the finite element software named ansys. And then, the paper describes the basic theory and algorithm of the measurement system,and derived geometric optics shadow moire fringe and algorithm of phase unwrapping. And designed a testing experimental system of micromorphology of Chip substrate.