High Power Diode Laser Au80sn20 Solder Preparation And Welding Technology Research

The solder is a filler material which the welding of high power diode laser is used to fill the gap junction chip and heat sink firmly combination. Solder welding, melting point, strength and Young’s modulus, coefficient of thermal expansion, thermal fatigue, and creep properties can affect the solder joint quality, so choose a suitable solder is one of the keys to obtain reliable package and connector. Au80Sn20alloy solder, a kind of precious metal solder, is often used in optoelectronic package and military electronic module with high reliability. Au80Sn20alloy solder has large strength, fine ant-oxidation, small melt point, low liquidity, excellent heat fatigue and creep deformation resistant. These merits make Au80Sn20alloy solder to be one of the perfect solders used in optoelectronic package.Study on the packaging process of high power diode lasers and thermal characteristics have been presented in this work. The fabrication technology and bonding technology of Au80Sn20alloy solder with different solder materials and solder structures have been researched theoretically and experimentally in detail. Main works are summarized as the following:1. Introduces the key technologies for high power DL package, unit diode laser package to determine the transition DL chip and the copper heat sink thermal expansion matching Cu10W90as heat sink, the thermal characteristics of high power DL.2. From the basic theory combined with the existing experimental conditions, using magne-tron sputtering the alloy target and the layered of the double-target sputtering method and prepared Au80Sn20alloy solder, the focus of both process technology roadmap, as well as process parameters, research the the Au80Sn20alloy oxidation kinetics, improve solder preparation process. Finally, experiments and analysis can be drawn through the experi-mental data, whether it is Au80Sn20alloy target or Au target and Sn target double-target the layered sputtering can be prepared Au80Sn20alloy solder the preparation Au80Sn20alloy solder surface is uniform obvious defects, dense structure, composition and theory of composition close, close to the melting point and the theoretical melting point.3. Improve the Au80Sn20solder alloy by magnetron sputtering process, prepared by magnetron sputtering Au80Sn20alloy solder welding standard high-power diode laser bars, different factors affect the welding quality, optimize the welding process, to determine the welding curve, and DL chip welding welding quality test. Drawn through the experimental data, whether it is Au80Sn20alloy target or Au target and Sn target double-target layered sputtering can be soldered diode laser welding strength, empty.4. Using the import deposition and our prepared Au80Sn20solder alloy welding continuous100W standard DL bars, and to test the welding parameters can be seen from the experi-mental results whether it is the import deposition or prepared Au80Sn20solder alloy welding DL chip out power, the conversion efficiency of thermal resistance, the center wave-length,"Smile" effect value, life is very close. The single target and double-target two processes can achieve high power diode laser package.