Secs/gem Of Semiconductor Equipment Automation System Design

With the development of the semiconductor manufacturing process and the wafer size increasing,300mm semiconductor wafer has now become mainstream wafer size, which makes the demand for automation of equipment and production becoming higher and higher. In this case, based on the ARM9embedded industrial control platform and interface, and according to the standard of SECS/GEM promulgated by the SEMI, the embedded automatic control system for the back end of semiconductor manufacturing is designed in this dissertation, which can support the automated production of the back end of300mm semiconductor wafer’s production.The dissertation is organized as following:Firstly, the development of the semiconductor industry is introduced and the protocol family of SECS/GEM is studied. In accordance with the function of protocol family SECS/GEM is divided into three layers:the layer of of SECS-Ⅱ and the layer of GEM.The SECS-Ⅰ/HSMS layer is known as transport layer, which defines how data is transmitted between device and host in the physical layer. The SECS-Ⅱ layer defines the format of data to be transmitted. While the GEM layer is known as generic device model, which defines the generic behavioral function of semiconductor equipment.Secondly, a circuit interface and an embedded board for automatic control of semiconductor equipment which based on Samsung S3C2440ARM9processor is designed. The embedded board integrates common storage system and numerous network interfaces and debugging interfaces. The interface circuit is responsible for conversion between voltage levels of semiconductor equipments and SECS/GEM messages. The hardware platform fully meets the needs of automatic control of semiconductor equipments.And then the SECS/GEM software system is implementated in chapter five, six, seven. The chapter five transplants embedded Linux operating system to the embedded board and design the overall framework of the SECS/GEM software; and the chapter six designs the SECS-Ⅰ/HSMS transport layer software; and the chapter seven completes the software design of SECS-Ⅱ layer and GEM layer.Finally, a comprehensive and systematic testing of SECS/GEM software and hardware semiconductor embedded control platform is involved. The test verfies that the system basically meets the automatic demand of the back end of IC manufacturing of300mm semiconductor wafer. At last the dissertation prospects on the development of the industry’s prospects and predicts follow-up studies.