Research On Temporary Package And Test Technology Of Microwave Bare Die

Bare die is the die without package. With the technique of electronic and communicationdeveloped in small-scale and intelligence, high integration, high performance and highreliability, microwave components and modules are required. Using microwave bare die toreplace the packaged one can fit the market demand well. Furthermore, to test the bare diequickly and efficiently becomes an important task of the microwave bare die qualityassurance program. However, at present, the way of probe test at room temperature is stillmainly used to obtain a certain quality assurance bare dies, which cannot match therequirement of high level reliability use that demands the bare die to be tested and burned-inin strict temperature environment. As a result, providing a system to acquire the microwavebare die which can achieve the user’s quality level requirement becomes an urgent problem.A temporary package is used to realize the microwave bare die test and burn-inexperiment. The bare die is packaged into a designed temporary package carrier and tested atthree demanded temperatures, then high temperature burn-in experiment can be carried out.First, the influence factors are researched and analyzed to optimize the design of themicrowave bare die package carrier and substrate. Second, suitable materials are chose torealize the design, such as PPS for the package carrier, Polyimide for the substrate, copper forthe carrier substrate, gold for the bond. An improved structure of micro-strip is used for themicrowave signal transition design,50ohm characteristic impedance is used to meetimpedance match. Then, after manufacture, character validation is carried out to prove thevolubility of the temporary package. After all, the WFDxx microwave power amplifier isloaded into the package. Normal experimental results are obtained by testing the packaged dieat high, normal and low temperature, including the output characteristic curve, the transfercharacteristic curve, the Gm-Vgcurve, S parameter curve, etc. At the end of this paper, ascheme of microwave test calibration and de-embedding is advanced.The test results mentioned above can well approve the reasonableness and engineeringpractical use of the temporary package. Positive influence in elevation of the domesticreliability technology of microwave bare die can be made by the study in this paper.