The Modification And Application Of Silicone Pressure Sensitive Adhesive

Silicone pressure sensitive adhesives （PSAs） has the basic properties of thepressure sensitive adhesive, in addition, it also has excellent high temperatureresistant and insulation performance. Therefore, it is used in the electrical orelectronic field in a wide range of applications. It has broad prospects fordevelopment of new adhesive. Today, science is developing and processing, thehigher performance requirements of PSAs is being called for especially. Theadhesive modification was concerned by more and more researchers in nanomodification field. Mainly because of the heat resistant levels of adhesive existinghave cannot satisfy the requirements of practical application. For insulation class ofthe adhesives, silicon pressure sensitive adhesive is a kind of organic silicon systemadhesive which has long been the identity with high heat resistance. If it is modifiedby nano-particles, it would improve the heat resistance in theory. It is also a researchdirection which many researchers are trying to change in the adhesive modification.The nano-SiO₂and nano-Al₂O₃are used to modify silicone pressure sensitiveadhesives. And for making soft composite materials by using the modified siliconepressure sensitive, polyimide film, with mica paper, non-alkali glass cloth for basematerial. The influence of the different nano-particles content on the thermal propertiesof silicone PSAs and the electrical performance of the soft compound material werestudied when the adhesive modified by single nano-particle. Meanwhile, contrastresearch alone using nano-SiO₂or nano-Al₂O₃modification and two kinds of nano-powder collaborative modified performance.The results of the study show that, the decomposition temperature of siliconePSAs both increased at first and then reduced with the nano content increasedcontinued when single in nano-SiO₂or nano-Al₂O₃modified. The decompositiontemperature of silicon PSAs after nano-SiO₂modified reached extreme value when the content is4.5wt%, in contrast, raised8.53%. But the nano-Al₂O₃reached14.07%;When two kinds of nano modified PSAs collaborative, and the nano content is1.5wt%, nano-SiO₂:Al₂O₃is1:3, the decomposition temperature of silicon PSAsafter modified reached12.53%. The test of soft composites material show that, thedecomposition temperature of silicon PSAs after nano-SiO₂modified reachedextreme value when the content is1.5wt%, in contrast, raised17.26%; The volumeresistivity is decreased with the increase of the nano content, The dielectric loss isdecline with the decreased of nano-SiO₂: Al₂O₃quality proportion.