Solving The Problem Of Warpage Issue By Applying6Sigma Methods

Coplanarity is the major factors affecting bonding reliability of SMT connector，it’s also a common quality defect for the connector with thin-wall. In this paper, smallthe best characteristics is applied to improve the part performance robustness with theanalysis of part quality control coplanarity process. The interaction and significance ofparameters that influence part warpage is analyzed using6sigma method.After a brief introduction to the resource and meaning of this project, the paperpoints out the primary theory and relevant concept of6sigma and show us how toanalysis the quality issue by use the DMAIC method. In the curse of the process, manyquality tool has been used including brainstorming, fish bone diagram, process flowchart, DFMEA,Gage-R&R, DOE and so on. Then some key parameters such as rawmaterial, structure of component,assembly method and interaction are determined.Finally the structure of injection molding part and metal stamping part are specified forthe purpose of reducing part warpage rapidly, which in turns can predict earnings ofoptimal product quality.Finally, the paper show the summary of the quality improvement work and thengive the opinion and future solution of the coplanarity problem.