Study And Solving Of AlSiCu Interconnection Holes Issue Induced By Post Metal Etching Cleaning

With the improvement of semiconductor manufacture technology and the decrease of cost, Integration circuits are more widely used in various aspects of our life. AlSiCu have good electric and thermal conductivity, and it is easy to fabricate. At the same time, the cost is low. So AlSiCu is widely used in the common Integration circuits'manufacture. AlSiCu use dry etch to manufacture. For anisotropic etch, there is etch reaction reside left at the side of the metal. It needs cleaning to remove the left metal, metal compound, other ions, and organic polymer later.In this paper, we will study the methods of metal etch residue cleaning. Analysis and solve the problem arose.1. Study the different cleaning method effect on cleaning result. The principle of cleaning can be divided into two kinds, dissolving and peeling off. For different process requirement and equipment condition, the two method of cleaning have them own merit and disadvantage. In this paper, we will find the suitable cleaning method to remove the metal etch residue base on our company's condition.2. Study the principle of holes appears and solves the problem. In our company's metal etch residue cleaning process, holes will arise after metal cleaning. This will affect products'reliability. In this paper, we will analysis the principle of the holes arising and solve the problem, optimize the solution according to the actually problem in the manufacture, and ensure the manufacture in our company.