A Study On Packaging Technology Of Ultraviolet LED

With the rapid development of chip and packaging technology of the ultraviolet light emitting diodes (UV-LED), UV-LED has been a hot spot due to its high luminous efficiency, long lifetime, energy saving, green for environment, instant-on/off and compact structure comparing with traditional UV light sources, making it a great potential market in industries such as curing. Some countries and regions have invested heavily to UV-LED R&D, which will further propel the development of related industries.Currently, the illuminant intensity of UV-LED remains at a relatively low level. Besides the improvement of chip fabrication technique, packaging technology also has an important impact on LED device's characteristics. This paper focuses on the packaging technology of UV-LED, and presents a fine structure with excellent light and thermal management based on the theoretic calculation and computation. Details are as follows:Firstly, this paper introduces the latest development of UV-LED domestically and abroad and the prospect and the future application are also elaborated. Then the problems existing in present UV-LED packaging are followed.Secondly, this paper introduces two important light-management fundamentals for UV-LED. One is as to light-route principle through LED lens; the other is the fundamental calculating approach for both planar and arc-shaped light radiation. Both of the two fundamentals belong to light management. Then computation is implemented and a detailed discuss is followed in an effort to make it clear how the packaging configurations affect the illuminant performance.Thirdly, a well designed UV-LED packaging structure with heat sink is presented based on the previous calculation and UV-LED's own feature, that is, high energy and heat density. In the packaging experiment, a selective of packaging materials is employed due to their excellent performances. Additionally, an arc-shaped UV-LED frame structure has been discussed and revised designs are determined.Finally, a few tests regarding light and thermal management of LED packaging are described. These tests are specially designed in order to check the packaging structure in terms of LED module's light and thermal performance.This research is to cope with the problems emerging during UV-LED packaging application; therefore this paper lays its great value on practice.