Study Of Microwave Multilayer Passive Components

The microwave development trend has already experienced from the cavity structure to the planar structure. During this period, the weight and size of the modules reduced obviously. However, the demand for the miniature of the microwave system is ever increasing. 3D circuits will obviously reduce the size of the module and the length of transmission line. It may bring changes to microwave circuits. This paper discusses this new area in the aspect of filters.Firstly, filters and diplexers traditionally use waveguide are realized in planar structure in SIW (Substrate Integrated waveguide). In recent years, SIW with both advantages of waveguides and planar modules is prosperous for microwave and millimeter wave modules.It has advantages high Q, no radiation. This paper introduces a filter and diplexer based on SIW technology, which the test result has reached the goal.According to the theory of generalized Chebyshev filters, chapter3 discuss how to improve the ability of the filter, in the view of microwave network. The cross-coupling, extracted poles filters and linear phase filters are synthesized in this paper.LTCC is one of the focuses of 3D-Circuits. The down converter module with multi layers is manufactured in LTCC. The module with vertical connetion is light weight, high circuit density. The test result agrees the simulation results.General speaking, 3D-Circuits can reduce the size, weight, which will become the main method for the design of the microwave modules. This paper paves the way for the further application.