Plasma In The Multi-layer Flexible Plate

Nowadays, the application and development of FPC(the flexible printed circuit board) is changing. However, there are still some important technological issues which need to be resolved, including cleaning bonding finger of FPC, enhancing the bonding force between reinforcement plate and FPC and improving the method of making blind vias. This paper focuses on the use of plasma to solve the above problems, the main research are as follows:1.The plasma was used to clean the bonding finger of FPC. The orthogonal test was taken advantage of to arrange experiment and analyze experimental parameters, and then the experimental parameters were improved in the experiment, Eventually, the best cleaning parameters which met the large-scale industrial production and cleaning quality were found.2.The plasma was used to enhance the bonding force between reinforcement plate and FPC. Firstly, the orthogonal test was taken advantage of to determine whether there was the interaction between experimental factors, and then to analyze etchbacking effect. Finally, the appropriate experimental parameters were found to etchback reinforcement plate in order to increase the surface area of reinforcement, that is, to increase the contact area between reinforcement plate and FPC, and for the purpose of enhancing bonding force between reinforcement plate and FPC.3.The plasma was used to make 200 micron blind vias respectively on the PI (polyimide), Polyester and PTFE no-glue double-sided FPC. The uniform design method was taken advantage of to arrange experiment. According to the experimental results, the regression equation was deduced by the mathematical approximation in order to forecast and control another variable through one or more of the value of variables, in the meantime, to verify the accuracy of the forecast and control. Finally, the optimum parameters of making blind vias had been determined by the uniform design method, and the standardized 200 micron blind vias could be obtained.