Electric Vacuum Components Of Solid Potting Materials And Technology Research

The solid encapsulation of the electronic vacuum device is an inevitable trend for the military electronic product development; However, there are still some urgent problems such as the delamination defect of the organic silicon gel encapsulation and withstanding pressure, the low temperature resistance defects after the epoxy resin encapsulation. A series of research focus on the practical problems during research and production process in this paper.The main results of this dissertation are as follows:1. The research on the process technique of solid encapsulation of the electronic vacuum device.The processes of preliminary drying, plugging and vacuum deaeration in the process technique of solid encapsulation of the electronic vacuum device is researched. The process parameters suitable for the electronic vacuum device is determined. Materials of solid encapsulation of the electronic vacuum device is researched. The mechanical properties, heat resistance properties and electrical properties of the materials is concerned. The effect of solidification temperature and solidification time on all the properties is Studied.2. The research on the delamination phenomenon of the organic silicon gel encapsulation for the electronic vacuum deviceStudying on the adhesion performance between the printed plate matrix of the electronic vacuum device and the material of the organic silicon gel and encapsulation; Studying on the adhesion performance between the printed plate matrix which has been dealt with using surface treatment agent and the material of the organic silicon gel and encapsulation; Studying on the variation of the adhesion performance about the printed plate matrix which has been dealt with using surface finishing agent after the experiment of accelerated ageing; Through the experiment's comparison and detection , we analyze the primary factor which may influence the adhesion strength, and determine the impact-discipline of the cleaning solvent, the cleaning method and the surface treatment agent etc on the adhesion performance between the printed plate device and the organic silicon gel ; Finally we put forward the process control measures which could solve the delamination problem.3. The research on the process technique for the epoxy resin solid encapsulation material of the electronic vacuum device.In connection with the features of the electronic vacuum device such as the complexity of the interior device.(Including the silver-plated metal solder pieces, the leading wire pillar, the standard insulation film, the lacquered wire, the ceramic etc); the special electric environment (the electric field, the magnetic field and the radiation field) and so forth,the experiment of the solid encapsulation for the epoxy resin could determine the precess conditions and parameter, complete the solid encapsulation under middle-low temperature, and make sure whether every performance indicator meet the demand for application after the solid encapsulation of the electronic vacuum deviceConclusion: Firstly,the pretreatment using thesurface treatment agent on the printed plate matrix proves to be an effective method solving delamination problem before the organic silicon gel encapsulation of the printed device. Meanwhile, it needs cleaning processing combining different cleaning solvent with different cleaning method before the product encapsulation. This measure can largely improve the adhesion strength between the printed plate matrix and the organic silicon gel.Secondly, the application process technique research of the epoxy resin solid encapsulation of the electronic vacuum device focuses on the different process experiment with the different encapsulation material, and the solid encapsulation experiment for the special transformer. The results show that the process operabilities for the HT-715 epoxy resin and the modified epoxy resin are feasible. However, the withstanding prsssure property can't fully meet the standard of the military electronic product. Therefore, it needs to continuously explore the index of the pressure-proof in the following research and achieve the target of the epoxy resin solid encapsulation of the electronic vacuum device.