| As benzoxazine has the properties of low-viscosity, good humidity-resistance, low-coefficient of thermal expansion and high heat-resistance, benzoxazine resin can be applied to electronic encapsulation material. In this paper, a series of new classes of electronic encapsulation materials possessing excellent properties based on benzoxazine resins have been developed. Furthermore, the curing reaction of these systems have been studied.Part I concerned the design and choice of formulae of high performance electronic encapsulation material based benzoxazine. Take the BS64-BOZ as the basic component of resin, the mono-functional benzoxazine within aldhyde group has been added into the system. The process characteristics of this precursor were investigated by means of Brookfield viscometer. Its initial viscosity at 80℃ was 0.17 Pa·s and was only 0.26 Pas after 250 min. When temperature was above 70℃, it showed good process-ability. It is concluded that the viscosity of resin can be modulated by adding ald-BOZ. The curing behaviors of ald/bs64 benzoxazine resins were studied by means of DSC, gelation time and FTIR. The test results showed that the resin can be cured at 150℃, which conversion at 150℃ for 5 hrs was 90.1%. If we want to get higher conversion, the resin should be post cured at 180℃, the... |
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