Vertical Through-hole Structure Of The Electromagnetic Characteristics Of Microwave Circuits And Test Methods

With the development of astronautics, communication and radar technology, miniaturization and high degree integration of RF or microwave circuits have become a new development trend. Therefore, the application of MMIC has received largely attention and research, and the design of via in MMIC has become an important subject.The characteristics of via holes in MMIC are studied in this thesis. The S-parameters influenced by via's geometrical sizes are discussed using the matrix- penciled moment method (MP-MM). Moreover, the experimental models of via are tested using the vector network analyzer (VNA) with de-embedding technology.Firstly, the mathematical model of via structure are introduced and analyzed. And then, the relationships are established between S-parameters and via's geometrical sizes, like the height and radius of via, the radius of ground plane hole, the radius of equivalent transmission line and the height of packing structure, etc. And also the S-parameters formulations are given for the numerical calculation.Secondly, the matrix-penciled moment method is applied to the full wave analysis and calculation of via structure, and the processes of mathematical calculation are detailed. At the same time, the results of electromagnetic simulation using HFSS are given. With the comparison of numerical results and simulation results, the correctness of numerical results is proved. By the analysis of numerical results of via geometrical sizes, the movement trends of S-parameters are obtained. What's more, the requests of geometrical size standard for via design and optimization are given.Finally, the de-embedding theory being used in the experimental test is introduced, and the technique and process of de-embedding are studied. The test results of DUT, which is designed as opening via model, are gained from VNA, and then the S-parameters of DUT with de-embedding are gained from the original data. Then, the experimental results compared with numerical results and simulating results is presented, and the suggestion is discussed for optimizing or mending the DUT design.