| A 8.5W microwave T/R module is designed in this paper, using MCM(multi-chipmodule) packing technology. The basic theory of MCM is given firstly, then three keytechnology in the design of Microwave MCM are studied, they are the analysis and designof crosstalk in MCM interconnects, the analysis and design of thermal, and theestablishment of failure prediction model.In the part of analysis and design of crosstalk, a transmission line based couplingnoise model that is simple while retaining accuracy in coupled Microwave MCMinterconnects is presented. This model decouples the coupled interconnects in complexfrequency domain, and transforms them into independent interconnects, so the process ofanalysis is abbreviated. The model is compared against ADS simulations and is shown tocapture both the waveform shape and peak noise accurately, the average error innoise-peak estimation is approximately 5.95%. Due to its simplicity and physical nature,the proposed model can be applied to investigate the impact of various physical-designoptimizations.In the part of thermal design, by means of the finite-element method, the paper firstlyputs forward a specific MCM model; Then, calculates its temperature field and heatdistribution, and studys the key factors of the far-reaching impact of peak value of thetemperature, in succession; The improved measures of heat-sinking capability are providedin the end.In conclusion, this paper takes the failure mode and mechanics of the GaAs MMICand MCM into account together, gives the failure rate prediction model of the MicrowaveMCM, which fits for the process in China. |
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