Within The Embedded Ltcc Three-dimensional Mcm Technology

It is well know that by with the development of VLSI, there are increasing demands for IC interconnection. The high-density package technology becomes mainstream in advanced systems. 3D Multi-chip module (MCM) is one of the new directions. It's a method to realize multi-layer structure in z direction. Its stacking can be using bare dice or 2D MCM. This 3D-MCM offers a lot of advantages in terms of electrical and thermal performance. It can provide higher I/O count, more system functions and perhaps lower cost. In this paper, we present a new approach to realize the embedded 3D integration by using some clapboard. This 3D-MCM made from 2D-LTCC substrates in which there are some resistances capacitors and inductors buried. Such contents as following are involved in this dissertation: 1. Characteristic, current developments and trends of MCM and LTCC are systemically introduced. The reasons and content of this paper are also introduced. 2. Buried LTCC's general process flow and design method are investigated. Also, the material of substrates, resistance, inductors and capacitors are introduced particularly. The LTCC substrates with buried passive elements are designed. Through the experiments, we probed to the suited process parameter and fabricated embedded LTCC module with glossy surface on the basis of solving a series of difficult problems about technology. 3. The total constructor of 3D-MCM is created. Directed by vertical interconnects, we bring forward a novel constructor with a clapboard and realized it in process flow. The 3D packaging module with exceed 100% density is obtained. 4. Finally, a LC band pass filters designed with LTCC is provided. Low Temperature Co-fired Ceramics (LTCC) is an excellent packaging technique for achieving highly reliable and miniature microwave multi-chip modules (MMCM). A microwave filter designed with novel hetero-junction structure and the way of vertical interconnecting on multiplayer was studied. The filter has a flexible structure and can be modified according to the technical condition. The 3D microwave filter was simulated and optimized by the electromagnetic field analysis software and gained a finer result.