Five-story Glass And Aluminum Static Key Co-mechanism And Stress Simulation

Static bonding is a special method using electricity, heat, power and other fields to bond with the metal, non-metals and semiconductors (such as glass, ceramics, etc.) by solid-phase thermal diffusion. The process has excellent characteristics: lower temperature, lower pressure, fast and easy and so on. The process has been developed as key technologies for packaging of micro-electromechanical system (MEMS) device. With the further development of microelectronics technology and the huge industrial demand, static bonding technology is used complexly and practically, and multi-layer static bonding is continuously generated according to actual demand and continuously developing in the new field of applied research.Because of the flaw of using two electrodes, like in the second bonding process reversal potential during the second bonding between the first bonding interface makes the strength on the first bonded interface worse and so on, it has made the improvement to use two steps and common anodic process multi-layered static electricity, and using this equipment to carry on the glass and the aluminum three-layer and five-layer static bonding experiment with common anodic process; By means of the scanning electron microscopy (SEM) and metallurgical microscope, the microstructure of the joining interfaces is analyzed; The microstructure of the bonding samples is analyzed by KEVEX SUPERDR 4 scanning electron microscopy (SEM) and metallurgical microscope, the fracture morphology of the shear areas of samples and distribution of chemical elements is analyzed by ultra-light element energy dispersive spectroscopy(EDS). It analyzes thoroughly the microscopic characteristic of transitional layer, discusses the interfacial polarization, the interface structure and the ion transport characteristic and so on, forms the ion dynamic migration mechanism about the multi-layered static bonding finally by these technological means. The paper uses the multi- function material testing machine to test the bonding intensity and the mechanical properties, and uses MARC software to analyze glass and the aluminum multi-layer static bonding warp amount of deformation and the distortion shape, the stress and the strain distribution rule when temperature cools from 500℃to 20℃.The finite element simulation results show that the samples of glass and aluminum of static bonding will produce residual stress and distortion from the bonding temperature to room temperature, and finite element analysis results showed that the maximum equivalent stress and maximum shear stress appears at the transition layer bonded on the specimen the sample, similarly to metal welding residual stress maximum is in the heat affection zone. Therefore, it is a weak point, but the finite element analysis of five-layer samples of static bonding glass and aluminum shows the maximum equivalent strain and deformation was significantly less than the two layers, which is due to five-layer glass and aluminum of static bonding were symmetrically distribution by the glass, so the residual stress and strain also showed a symmetrical distribution. The existence of this structure can slow deformation, which has a great value for MEMS devices in the package design and reasonable arrangements, and improve the quality of the MEMS package.