| In recent years, the quantity of electronic wastes increased rapidly. The ingredients of electronic wastes are complex, dealing it with improper ways will damages environment and people's health seriously. The waste Printed Circuit Board is the hazardous solid waste; the number of it grows fastest in the city, the recycling value of it is higher than other solid waste. Recycling the utilization of the waste Printed Circuit Board can not only reduce pollution but also recycle the useful component.In numerous methods of recycling Printed Circuit Board, Physical method has certain superiority because of it avoid drying product and dealing with sludge in Hydrometallurgy, high consuming energy and secondary pollution in Pyrometallurgy and so on.The first step of recycling Printed Circuit Board in Physical method is unsoldering the electronic component. The process of unsoldering the electronic component has two pivotal steps: electing the method of pyrogenation and investigate the force of disassembly. At present, the methods of heating in common use include Hot-air, Infrared, Laser, and Hot-Liquid. Because the technologies of seal are different, the forces of disassembly are not uniform.This paper bases on analyzing the domestic and foreign technologies of disassembling components in PCBs. Establishing the evaluation model of calefactive methods by comparing the four manners of heating: Hot-air, Infrared, Laser, and Hot-Liquid. The result is that Hot-Liquid is better than other methods. Then, this paper analyses the wallop of experimental equipment, investigates the relation about the influence of the components'pins and the force of disassembly, and establishes the model about the force of disassembling components. According to the factors of influencing the force of disassembly, the last chapter arranges the experiments about disassembling Through Hole Device with the Orthogonal Design Method. At last, the paper gives the most superior experimental condition disassembling components. |
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