| With the continuous growth of the market demand of the embedded systems based smart products, the manufacturers have been more and more concerned about how to more effectively complete software solidifying process in production and maintenance. To this end, a sort of embedded software tool of solidifying which meets the actual demand has been developed. The tool uses the client server-based working-model to control the solidifying operation, and is divided to three main parts of communication protocol, BSP and hosting services.Solidification communication protocol is the numbering plan, which must comply with BSP and software services for the exchange of information and data packets. In the solidifying tool, the agreement was designed to pack combination with a fixed framework and a flexible content. On the one hand, order package and feedback package are designed in a similar structure, which contains head, content and tail. On the other hand, an order form and structure of the package of changes are designed to set aside a lot of space.BSP running on target board, it is designed not only as a guide start-up procedures, but also supports the operation for solidifying the agreement, and it has full function. With power on, it tests whether certain conditions have been met, then determines whether to give up to guide the operating system and switchs to run solidifying operation support code.Hosting software is running on the PC in the multi-threaded interactive process. It completes various actions by analyzing input order. The software is designed to be able to establish communication links through operation agreement with I/O ports with target board that has running BSP, but direct control the MCU on the target board through the JTAG as well. On the one hand, if the target board has a BSP the solidifying operations can be done through high-speed I/O port rapidly. On the other hand, if the target board doesn't have BSP, MCU is controlled to download and run a small BSP at first. |
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