Design And Thermal Analysis Of Bonding System Used For RFID Tag Packaging

Electronic packaging technology and equipment have a significant impact on quality, dimensions and cost of electronic products. In this thesis, a bonding system for RFID tag packaging is proposed, and thermal analysis is performed on bonding head and assembly process.Three main kinds of conductive adhesives ICA ACA and NCA, used in flip chip technology, is compared. By considering their performance in efficiency and cost, ACA thermocompression technology is chosen for RFID tag packaging. The bonding system's mechanical structure and workflow is designed based on the requirements of manufacturing method and ACA specifics. Specially, a miniature bonder with force and temperature control functions as well as simple structure and low cost is developed.A temperature PID control system based on SCM is proposed, which is also with a compensation system. By using Lumped-Para method, the equivalent steady and transient electrical network model of the bonder is developed to perform the thermal analysis. The bonder's steady thermal analysis is also performed by using ANSYS WorkBench software. The validity is proved by compared the result with measuring data.Finally, the thermal model of assembly process is proposed. Transient thermal simulation is performed by Flotherm to analyze thermal response of the ACA in the assembly process. The key point to enhance the bonding performance is discussed by compared the simulation results in different bonding methods and parameters.