Study On Uncooled Infrared Imaging Device With Reflecting Optically Readout

This thesis focuses on the new fabrication based on the MEMS technology and the new pixel design of uncooled infrared imaging devices with reflecting optically readout for 8～14μm IR wave band.As for the device fabrication,this thesis gives a method based on Liftoff technology to reduce the inclination of mirror and improve its flatness,meanwhile,this method does not reduce thermal-mechanical sensitivity or reflectance of visible light because it achieves different thickness of Al film in micro-mirror and bimaterial beam.Besides,a new technology using SiO₂ as the preventing layer is developed to solve the XeF₂ releasing asymmetry existing in old technology.The surface roughness of the mirror is measured by the WYKO Profiler,and a platform is set up to test thermal-mechanical sensitivity of those pixels.Finally,this thesis studies some relative theory and proposes a novel optically readable infrared imaging array device with "Temperature compensation beams" pixels. The pixel not only has high sensitivity to infrared radiations,but also has excellent characteristic to reduce the negative influence induced by the fluctuation of environmental temperature.The geometric parameters of the structure have been designed and optimized by investigating the relations between them and some relative performances.Thermal-mechanical sensitivity and NETD of the device designed are estimated as 4.78×10^-3rad/K and 2.42 mK respectively.The compensation characteristic of the "Temperature compensation beams" has been proved through ANSYS simulation.