Software Development For The Automatic Alignment System Of The High Accuracy Chip Bonders

The automatic alignment system is one of the most key parts of the high accuracy Chip Bonders. Generally, it consists of special hardware and software. As a result, the hardware is expensive and the software is hard to transplant. It is of great significance to develop an automatic alignment system with independent intellectual property based on universal hardware and software with broad prospects for application. The main research contents about the software of the automatic alignment system in the dissertation are as follows:The principles of the automatic alignment system and design method of structure of the high accuracy Chip Bonders are discussed. This system comprises lighting system, optical system, CCD camera device, image processing unit, motion control system and so on. The techniques of image processing and the part of the motion control are the determinant part for the automatic alignment system. Moreover,requirements analysis for the system software is conducted.Image processing algorithms such as threshold segmentation, image filter, image edging, edge detection, sub-pixel edge extraction are discussed. And the relevant modules for image processing are empoldered and realized in the software. The parameter of the pixel transform quantum of the imaging system is calibrated, and the simulated experiments are put up for analyzing the precisions of sub-pixel edge extraction.The control project for lamp-house, light-pathway and electromotor using motion control card are designed. The software to drive and control the hardware is programmed. The system has high precision of movement and orientation. A method of measuring displacement directly using standard reticle and CCD is proposed.Based on the research for the techniques of image processing and motion controlling, the software for the automatic alignment system has been developed. The results of the experiments have proved that this software system can realize high precision alignment between the CMOS chip and the floor automatically.