Design Of Signal Integrity And Electromagnetic Compatibility In High Speed Interconnection Design

With the increase of integrate circuit switch rate and PCB (printed Circuit Board) density, Signal Integrity has become one of main problems in high-speed design. Some factors such as parameters of devices and PCB, layout of devices on PCB and trace of high-speed signal may result in the unstable or even none operation of system. How to fully consider Signal Integrity and take effective measures has been one of the pop task in PCB design trade. Simultaneously, in PCB and MCM systems the ability of radiation increase significantly, which may cause serious electromagnetic compatibility (EMC) problems.Instead of cover all the topics in the problems of signal integrity and electromagnetic compatibility in this thesis, each typical problem is chosen from SI and EMC respectively. For signal integrity, crosstalk among multi-conductor is researched by NEXT (Near End Cross Talk) and FEXT (far End Cross Talk) analysis, which is an engineering method. For electromagnetic compatibility, common-mode current problem is studied by PEEC arithmetic, on which the studying of reducing differential-mode radiation with multi ground line is based.