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Keyword [coefficient of thermal expansion]
Result: 1 - 11 | Page: 1 of 1
1.
Research On Properties And Mechanism Of Substrate Materials With Low Thermal Expansion Coefficient
2.
The Structure And Properties Of Al/SiCp Composites Preparated By Pressureless Infiltration For Electronic Packaging
3.
Study On Electronic Encapsulation Material Basied On Benzoxazine Resin
4.
Study On Diamond/Copper Composites Fabricated By Surface Metallization-Chemical Co-Deposition Method In Electronic Packaging Application
5.
Properties Of β-SiC_p/Al Electronic Packaging Material Fabricated By Pressureless Infiltration
6.
Pressureless Infiltration Prepare For SiC/Al Electronic Packaging Materials
7.
Analysis Of Thermo-mechanical Stress In3-D Package With Through-Silicon Via
8.
Semi-solid Extrusion Of Spray-deposited Al-27%Si Alloy
9.
Preparation And Mechanism Research Of Ba-Al-B-Si Glass/ceramic Packaging Materilas With High Coefficient Of Thermal Expansion
10.
Research On The Influence Of The Reliability Of Metallized Holes On Printed Boards
11.
Warpage Research And Solutions For Large Panel Level Fan-out Package
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