Self-Assembly Processing Technology Based On Mechanical-Chemical Method

According Moore law, the integration level of the microchips doubling each 18 months. The integration level lies on the width of reticle. When the width of reticle is less than 30nm, the semiconductor material achieves its physical limit, and it would be happen that quantum effect. Along with the integration level is higher and higher, the size of the device is reducing, so it needs new manufacture method to expand the limit size under 30nm. With the aids of the high resolution of AFM, self-assembly which use molecular scale material as unit to fabricate nanometer scale structure could realize this goal.This thesis carried out controllable self-assembly on silicon surface with a mechanical and chemical combined method, and provides an experimental basis for fabricating nano-structure. First of all, 1-Hexadecene self-assembled monolayers was fabricated on hydrogen-terminated silicon surface by traditional way and was checked by XPS and Raman spectrum technology. The topography and the nano-mechanical property of the sample before and after self-assembly was characterized by AFM, and the factor attributed to the change was analyzed. Based on the above conclusion, the nano-mechanical property of the sample fabricated with the technology based on the scratch of AFM microprobe combining traditional self-assembly method was analyzed. It was proved that this method could carry out controllable self-assembly on silicon surface; finally, the nano-mechanical property of the sample fabricated with the technology based on the cutting of diamond tool was measured, and this method was proved to be a quick and convenient mean that could carry out controllable self-assembly on silicon surface according to the nano-mechanical property of the samples fabricated by the two method before.