Parameter Extracting Of Interconnection Line And Via In High-speed Integrate Circuit

In the modern high performance integrate circuit (IC), due to the developing of the submicron and deep-submicron technology, the characteristic size of the IC chip decreases, so that the parasitical parameter effects are not important. In this case, interconnection lines between the chips in the Multi-Chip Module (MCM) or Printed Circuit Board (PCB) have become the important factors of the signal integrity and entire system performance. To protect circuits and support the whole circuit configuration, packages are absolutely necessary. Some package structures have obvious influence on the transmitting of the high-speed signal. The electrical property of interconnects and packaging structures in the high-speed large integrated circuits becomes one of the key techniques in the design of new generation micro-electronics systems.The theory of the method of moments (MOM) is introduced firstly in this thesis, and some basis functions and testing functions were discussed, then computation of the current distribution on the linear antenna was also introduced, which laid the foundations of investigation on the electrical property of a via by using Full-wave analysis.The amplitude and the complex propagation constant of every current mode on interconnection lines were investigated in the third chapter of the thesis, and the method of Generalized Pencil-of-Function was used to estimate the unknown current on interconnection lines.The mechanical property, the parasitical capacitance and the parasitical inductance of the via structure were introduced in the fourth chapter, and the excess inductance of the via structure was computed by using quasi-electrostatic method.In the end, the current distribution on the via was computed by the pocklington integral equation. The amplitudes of incident and reflected wave were extracted by the method of Generalized Pencil-of-Function and the scattering parameters of the via structure in high-speed integrate circuit were also obtained.The investigation was very useful and significant for designing the high-speed integrate circuits.