A Full System Simulator And The Thermal Management Research By Task Scheduling For 3D NOC

3D IC technology allows Network-On-Chip (NoC) 3D stacked and make relevant multi-core system continuing developing. Thermal issue becomes more critical because of the increasing power density caused by 3D stack. OS-level task scheduling is an effective method to improve on-chip temperature condition.In this paper we propose a thermal management method using task scheduling to limit chip temperature under the required constraints as well as consider performance degradation caused by moving task to a core far away from its data. As a prerequisite for research, a full system simulator was developed, which includes hardware (IPs and Network), software and evaluation tools for power and temperature. A temperature controller was implemented in our simulator to determine temperature management actions and some modifications were done in OS to support task scheduling. The result shows that coldest and random scheduling would cause about 30% performance penalty, but our algorithm has lower performance loss with about 14% which meet the temperature constraint as well.Date aware temperature control algorithm together with the full system simulator would provide fast prototype for 3D NoC design, participate the SW/HW co-design, feedback analysis for system include temperature condition, that would speed up the development of the design.