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Study On Long Term Reliabilty Of ECA For Microelectronic Package

Posted on:2003-10-29Degree:MasterType:Thesis
Country:ChinaCandidate:D H ChenFull Text:PDF
GTID:2168360062975120Subject:Microelectronics and Solid State Electronics
Abstract/Summary:PDF Full Text Request
The sort, material composite, structure properties and conduction mechanisms of ECA( Electrical Conductive Adhesive) were discussed in this paper. Then three types of EGA specimens were designed and made, on which temperature cycles test from -55 癈 to +125癈 and thermal aging at +125癈 were carried out. Changes of the adhesive strength, ECA's bulk resistance and contact resistance under the environment stress were summarized and a detailed evaluation on these specimens was given. Computer simulations were performed to predict the percolation thresholds and resistiveties. Based on the result of simulations and reliability test, some advice on improving the conductivity and reliability of EGA was proposed, and recent advances on EGA were introduced. Through all these work, a practical method for designing test structure, setting up automatic measurement system, collecting test data, and dealing with statistical data was given.
Keywords/Search Tags:ECA, Reliability, Enviroment test, Measurement system, Solder
PDF Full Text Request
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