Study On Waffle Slab In The Construction Of Electric Chip Plant And Its Application

In the electric industry,clean room becomes the base area in the construction of the electric COMS chip manufactory.Technical methods of construction is also an importance guarantee of quality,serving as a gradual approach to design model in the practical projects.Since the processes of design and execution are equally important,so we will discuss the issue of how to guarantee execution in the essay hereof.This article takes FRP waffle slab in the project of Kunshan IC Spectrum 8 inch wafer of chip manufactory as an example,explains its specific application in the aspects of formwork selection,processing,installation,RC construction and indication repair. In addition,through research of nearly 1 m thick slab of the support system to address the large thickness of the floor in the construction,the safety support system;through research Miller banding reinforced beams to solve the template system in the protection of multi-channel steel beam vertically and horizontally banding problems;through frp repair template to resolve the resin material in the field of application.Besides,a constructive description of ERP waffle slab from the point of construction focused on process,schedule coordination,technical innovation,safety guarantee and cost efficiency is provided in the article hereof,which aims to provide theoretical and technical basis for brand building in electronic industry,and a reference for similar projects.