Dropping Analysis And Simulation Of Product Package

Drop impact is the main cause for the damage of products in the process of the circulation and use,and the impact course is a complicated dynamic response process.It is an efficient way to study and numerically simulate the dropping impact of the product package with the help of the combination of experiments and finite element method to solve the questions of drop.This paper conducts the research on impact dynamics of product package in the following aspects:First,this paper presents the finite element theory of the impact issue,and emphatically elaborates the application of finite element software ANSYS and LS-DYNA and the process of the joint solution and the superiority of solving the drop impact problem.Second,this paper takes a simple model of the cushion package as the research object,and the response of the system using finite element simulation is studied and compared with experiments.Based on the application of finite element drop simulation,the cushion properties of various packaging structure is studied to gain a research method,which evaluates cushion performance.The results show that the finite element simulation results can intuitively analyze the dynamic response of the packaging and find out the geometric structural factors that influence its cushion properties,and then obtain the packaging structure from which has the best cushion performance.Third,the impact behavior of more complex packaging system has been further investigated. This paper,taking LCD Monitor as the object,has further established the solid model of the LCD Monitor and its package based on Pro/E three-dimensional software.Using ANSYS/LS-DYNA finite element soflware,this paper has conducted the simulation analysis for the impact dynamics behavior of the liquid crystal display and packaging items under different dropping conditions, and has studied the impact response of the bare-metal main body and key components of the LCD Monitor under different dropping conditions and the impact response of the key components of the LCD Monitor,packaged and not packaged,under the same dropping conditions.Combining with tests,the response acceleration for key components of the products have been compared with each other.,analyzing the energy absorption of the buffer packaging structure according to simulation results.It is important on engineering for constructing packaging design to analyze dropping impact of product packaging with the help of finite element method and experiments,which provides some scientific basis for design and optimization of cushion package structure.