Model Analysis Of The Multi-Wire Saw And Surface Quality Prediction

With the rapid development of solar cell and large scale integrated circuits industry, conventional silicon processing methods can not meet the current needs. It has many shortcomings such as inefficient, poor surface integrity, small processing size, high cost, etc. As many merits such as efficient, thin slice, large processing size, etc., multi-wire sawing rapidly becomes the mainstream of the market. As China's development lags behind, multi-wire sawing mostly dependent on imports. It is very constraining the development of IC industry. The research of multi-wire sawing, though still in its infancy, has been widely accepted.In this paper, we analysis of the material removal mechanism of the multi-wire sawing, calculate the overall stiffness of the machine tool, model and predict the surface roughness of multi-wire sawing.In free abrasive multi-wire sawing, slurry is the main reason for the material removal. It has two effects on the surface, as the effect of fluid and SiC abrasive. Through analysis and comparison of these two effects, identify the main reason of the material removal.Modal analysis can determine the vibration characteristics of the institutions or machine parts. It is the natural frequency and structure formation, which are dynamic loads in structural design of the important parameters. Using the ANSYS software to calculate the overall stiffness of the multi-wire sawing CNC, the reasonableness of the layout can be analyzed.Based on the traditional two-dimensional surface roughness evaluation method and combined with features of the free abrasive multi-wire sawing technology, a theoretical model of the surface contour is established and verified by experiments. Uneven surface roughness in the same section is found, and the reasons for this phenomenon are analyzed.