Simulation And Experimental Research Of Cutting Force Modeling And Analysis Based On Wire Saw Topography

Hard and brittle materials have been widely used in various fields,such as aerospace,shipbuilding,national defense industry for its excellent properties,such as oxidation resistance,high strength,corrosion resistance,high temperature resistance and other characteristics,However,hard and brittle materials are typical difficult-to-machine materials because of its high hardness,low toughness.Using traditional methods such as turning and milling,the machined surfaces are prone to micro-cracks,sub-surface damage and other defects,which is difficult to meet the processing requirements.The Fixed Diamond Abrasive Wire Saw(FDAW),which has some advantages of high machining efficiency,low kerf loss and long service life,has become one of the preferred cutting methods for hard and brittle materials.The processing principle of FDAW is similar to grinding,which belongs to abrasive processing.Many factors such as the random size and shape of abrasive particles make it difficult to study the removal mechanism by experiment.Generally,Finite Element Analysis(FEA)is used to study the removal mechanism of hard and brittle materials in abrasive processing,which can easily detect the related physical quantities and phenomena of machining process.Therefore,in order to study the removal mechanism of hard and brittle materials during abrasive processing,it’s necessary to do finite element simulation for sawing process.In this paper,FDAW was taken as the research object,and the single abrasive geometry model and the parametric modeling of wire saw surface morphology were established.On the basis of these two models,the simulation of single abrasive particle cutting and overall wire saw cutting were performed.Finally,the effectiveness of single and multiple abrasive particle cutting models was verified by single abrasive particle scratching experiment and wire saw cutting experiment.Specific work content includes:First,a virtual abrasive particle model was generated using the sphere splitting method by random space plane.Wire saw surface topography model,which has a random distribution of abrasive particle shape,size and position,was established by using Gaussian distribution and cylindrical coordinates.Through the secondary development of ABAQUS software,the parametric modeling of the model was realized.The distribution,shape,size of the abrasive particles on the surface of the wire saw were detected by digital microscope.Based on this,the parametric simulation model of experimental wire saw was establishedSecond,the finite element simulation and experimental verification of single abrasive particle scratching of silicon carbide ceramic were completed.Based on the virtual abrasive model,the JH-2 material model was used to simulate silicon carbide ceramics,and a finite element model of single abrasive particle cutting silicon carbide ceramic was established.The influence of the geometric characteristics of the abrasive particles and process parameters on workpiece stress and cutting force was analyzed.Furthermore,the experiment of scratching silicon carbide with a single diamond abrasive particle verified the validity of the modelResearch on the removal mechanism of brittle materials with multiple abrasive particles was simulated in the last part.On the basis of three-dimensional model of the wire saw,the periodic media technology was used to build finite element model on simulating the overall cutting process of FDAW for SiC single crystal.By simulation,the material removal mechanism was analyzed,and the material removal process and the cutting force in the microscopic state were discussed.The influence of process parameters such as wire saw speed and workpiece feed rate on cutting force and stress was obtained.Finally,the effectiveness of multiple abrasive particle cutting model was verified by the experiment of cutting silicon carbide...