Femtosecond pulsed laser processing of electronic materials: Fundamentals and micro/nano-scale applications

Ultra-short pulsed laser radiation has been shown to be effective for precision materials processing and surface micro-modification. One of advantages is the substantial reduction of the heat penetration depth, which leads to minimal lateral damage. Other advantages include non-thermal nature of ablation process, controlled ablation and ideal characteristics for precision micro-structuring. Yet, fundamental questions remain unsolved regarding the nature of melting and ablation mechanisms in femtosecond laser processing of materials. In addition to micro engineering problems, nano-structuring and nano-fabrication are emerging fields that are of particular interest in conjunction with femtosecond laser processing.; A comprehensive experimental study as well as theoretical development is presented to address these issues. Ultra-short pulsed laser irradiation was used to crystallize 100 nm amorphous silicon (a-Si) films. The crystallization process was observed by time-resolved pump-and-probe reflection imaging in the range of 0.2 ps to 100 ns. The in-situ images in conjunction with post-processed SEM and AFM mapping of the crystallized structure provide evidence for non-thermal ultra-fast phase transition and subsequent surface-initiated crystallization.; Mechanisms of ultra-fast laser-induced ablation on crystalline silicon and copper are investigated by time-resolved pump-and-probe microscopy in normal imaging and shadowgraph arrangements. A one-dimensional model of the energy transport is utilized to predict the carrier temperature and lattice temperature as well as the electron and vapor flux emitted from the surface. The temporal delay between the pump and probe pulses was set by a precision translation stage up to about 500 ps and then extended to the nanosecond regime by an optical fiber assembly. The ejection of material was observed at several picoseconds to tens of nanoseconds after the main (pump) pulse by high-resolution, ultra-fast shadowgraphs.; The ultrashort laser pulse accompanied by the pre-pulse induces air breakdown that can be detrimental to materials processing. A time-resolved pump-and-probe experiment provides distinct evidence for the occurrence of an air plasma and air breakdown. This highly nonlinear phenomenon takes place before the commencement of the ablation process, which is traced beyond elapsed time of the order of 10 ps with respect to the ablating pulse. The nonlinear refractive index of the generated air plasma is calculated as a function of electron density. The self-focusing of the main pulse is identified by the third order nonlinear susceptibility.; A crystalline silicon sample is subjected to two optically separated ultra-fast laser pulses of full-width-half-maximum (FWHM) duration of about 80 femtoseconds. These pulses are delivered at wavelength, λ = 800 nm. Femtosecond-resolved imaging pump-and-probe experiments in reflective and Schlieren configurations have been performed to investigate plasma dynamics and shock wave propagation during the sample ablation process.; By using a diffractive optical element (DOE) for beam shaping, microchannels were fabricated. A super-long working distance objective lens was used to machine silicon materials in the sub-micrometer scale. As an extension of micro-machining, the finite difference time domain (FDTD) method is used to assess the feasibility of using near-field distribution of laser light. Gold coated films were machined with nano-scale dimensions and characterized with atomic force microscopy (AFM).