| A self-aligned fabrication process for small and large emitter contact area (2 × 4 μm2 and 1.96 × 103 μm 2 respectively) GaN-based heterojunction bipolar transistor and bipolar junction transistors is proposed. The process features dielectric-spacer sidewalls, low-damage dry etching and selected-area regrowth of GaAs(C) on the base contact, and self-aligned emitter base regrowth processes are provided. The junction current-voltage (I–V) characteristics were evaluated at various stages of the process sequence and provided an excellent diagnostic for monitoring the effect of plasma processes such as CVD or etching. A comparison is given with large emitter-area devices fabricated on the same material. The small-area devices are attractive for microwave power switching applications, provided that a high-yield process can be developed. Series resistance effects are still found to influence device performance.; In the dc performance of small and large emitter contact area GaN-based heterojunction bipolar transistors, the do current gain of both types of device improves with temperature, which we ascribe to higher ionization efficiency of the Mg acceptor in the p-base region. The presence of a resistive base layer at room temperature forces base current to flow directly to the collector, reducing the current gain.; However, to date, all of the reported GaN-based heterojunction bipolar transistors (HBTs) and bipolar junction transistors (BJTs) have had lots of problems to be solved even if there are many advantages to this technology. To predict the performance of GaN-based HBTs and BJTs, we simulated these structures with 2-dimensional device simulators.; The effects of base doping and thickness on do current gain, collector-emitter saturation voltage, saturation current, collector-emitter breakdown voltage, rf characteristics (fT) and the effects of impurity ionization as a function of device operation temperature of GaN, AlGaN, InGaN-based heterojunction bipolar transistors, and junction bipolar transistors were investigated using a drift-diffusion transport model.; Different base layer designs (including superlattice bases) for GaN-based heterojunction bipolar transistors (HBTs) and BJTs were simulated with MEDICI code.; Given the low ionization efficiency of Mg acceptors in the base, it is important to design structures that avoid depletion of the base layer. The presence of a resistive base causes current to flow directly to the collector, severely reducing gain. The temperature effects of GaN-based heterojunction bipolar transistors were investigated by simulations. The contact resistances are all significantly decreased at high temperatures, where ionization efficiency is maximized. |
