| This work presents the use of organic multilayer lamination of epoxy-glass printed wiring board material to produce microfluidic structures, and the exploitation of these structures along with integrated drivers to develop a synthetic-jet-based integrated cooling solution for electronic systems. This process implements the synthetic jet to produce an active cooling substrate (ACS), in which the jet driver, ducting, and outlet ports for chip cooling are integrated in the thickness of the printed wiring board substrate. The electromagnetic actuator, which consists of a permanent magnet and a voice coil, is used to vibrate the laminated polymeric corrugated diaphragm. Two prototypes of ACS devices, vertical and tangential, are developed. The fluid mechanics and thermal performance of these devices are characterized. A computational fluid mechanics software package, Fluent, is employed to explore the synthetic jet fluid mechanics and heat transfer problem from the numerical solution perspective. Based on the experimental and simulation results, a sophisticated methodology is developed for future engineering analysis to design new synthetic-jet-based microjet devices with optimal geometries to fulfill different application requirements. |
