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Silicon/silicon germanium heterostructures: Materials, physics, quantum functional devices and their integration with heterostructure bipolar transistors

Posted on:2006-12-13Degree:Ph.DType:Dissertation
University:The Ohio State UniversityCandidate:Chung, Sung-YongFull Text:PDF
GTID:1458390008974729Subject:Engineering
Abstract/Summary:
With the advent of the first transistor in 1947, the integrated circuit (IC) industry has rapidly expanded with the tremendous advances in the development of IC technology. The driving force in the evolution of IC technology is the reduction of transistor sizes. Without a doubt, transistor miniaturization will face fundamental physical limitations imposed by further dimensional scaling of silicon transistors in the near future.; According to the 2004 International Technology Roadmap for Semiconductors (ITRS), the width of a gate electrode for complementary metal-oxide-semiconductor (CMOS) is projected to be a mere 7 nm by the end of 2018. No further solutions have been found. Since the 2001 ITRS, tunneling devices have been evaluated as an emerging technology to augment silicon CMOS. Transistor circuitry incorporating tunneling devices realized using III-V semiconductors has exhibited superior performance over its transistor-only counterparts. However, due to fundamental differences in material properties, such technology is not readily compatible with the mainstream platforms (>95% market share of semiconductors) of CMOS and HBT technologies. Recently, we demonstrated the successful monolithic integration of Si-based resonant interband tunnel diodes (RITDs) with CMOS and SiGe HBT, which makes them more attractive than III-V based tunnel diodes for system level integration.; This dissertation is concerned with the development of quantum functional tunneling devices, RITDs, and high-speed transistors, HBTs, using Si/SiGe heterostructures as well as material growth and electrical properties of Si/SiGe heterostructures. Emphasis is placed on the development of Si/SiGe-based RITDs, HBTs, and their monolithic integration for 3-terminal negative differential resistance (NDR) devices. The operating principles of Si-based RITDs and the integration of RITD with HBT are also discussed.
Keywords/Search Tags:Devices, Integration, Transistor, HBT, Heterostructures, CMOS, Ritds
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