| Semiconductor devices are extensively used both in our daily life and in industry. They are critical components in many electrical appliances and high-tech equipments. Electrical heating of a semiconductor device is a very common phenomenon. In many situations, it is important to understand the impact of temperature on the performance, stability and lifetime of the device. It has been observed that if temperature is too high certain devices can develop cracks or other undesirable results. The mathematical literature ([2, 4, 33]) on this phenomenon has not dealt very much with temperature effects and the thermoelastic aspect. It has only considered the case when the temperature of devices is constant while ignoring the contribution from the deformation of bodies of devices. My research is to fill the gap and consider semiconductor equations with temperature effects and thermoelastic aspect. |
