Antenna-coupled infrared and millimeter-wave detectors: Fabrication, measurement and optimization | Posted on:2007-05-11 | Degree:Ph.D | Type:Dissertation | University:University of Central Florida | Candidate:Middleton, Charles F., IV | Full Text:PDF | GTID:1448390005474233 | Subject:Engineering | Abstract/Summary: | | Antenna-coupled detectors provide uncooled, cost-effective solutions for infrared and millimeter-wave imaging. This work describes the design, fabrication, measurement, and optimization of several types of antenna-coupled detectors for LWIR (8--12 mum) and 94 GHz radiation. Two types of millimeter-wave antenna-coupled detectors were fabricated and tested: a slot antenna coupled to a bolometer, and a patch antenna coupled to a SiC Schottky diode. Electromagnetic modeling of the antennas helped guide the design of antennas with better impedance matching to the detectors. Schottky diodes are discussed as detectors for millimeter-wave and infrared radiation, with the goal of increasing the cutoff frequency to allow infrared detection. The magnitude of response of antenna-coupled bolometric detectors to infrared radiation is affected by the thermal-conduction properties of the sensor structure. Two fabrication processes were developed to improve the thermal isolation of the antenna-coupled bolometer from its substrate. The first process creates a membrane beneath the device. Measured results show a factor of 100 increase in responsivity over an identical device without a membrane. The second process thermally isolates the device from its substrate by suspending the metallic structure in air. Several factors for optimization of infrared antenna-coupled detectors are investigated. The complex dielectric function of the metal from which the antenna is constructed can affect the performance of the device. The use of a ground plane and dielectric standoff layer beneath the antenna can increase the sensor responsivity. Dielectric material properties and thicknesses are considered, and incorporated in device simulations. Finally, a potential fabrication process is presented for via connections from the antenna-coupled detector through a ground plane to bond pads to mitigate the effect of bias lines on antenna behavior. | Keywords/Search Tags: | Antenna-coupled, Detectors, Infrared, Millimeter-wave, Fabrication | | Related items |
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