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Integrated Hybrid Silicon Triplexer

Posted on:2011-07-08Degree:Ph.DType:Dissertation
University:University of California, Santa BarbaraCandidate:Chang, Hsu-HaoFull Text:PDF
GTID:1448390002460484Subject:Engineering
Abstract/Summary:
A triplexer that provides a triple play service (data, voice, and video) is considered a key component for a fiber to the home (FTTH) network. The triplexer is used at the customer premise and it is capable of uploading Internet data through the 1310nm channel, downloading Internet data and voice data through the 1490nm channel and receiving video signals through the 1550nm channel. Therefore, three key components are required for a triplexer: a wavelength demultiplexer which can separate 1310nm, 1490nm and 1550nm channels, a 1310nm laser and two photodetectors responsive at the wavelength of 1490nm and 1550nm. Traditionally, most triplexers are achieved by passively assemble the individual laser and photodetectors on the demultiplexer circuits, which is not only time consuming but also cost and device size inefficient. Therefore, in this dissertation, we would like to develop an integrated triplexer with a laser and two photodetectors integrated on it to improve the fabrication time, cost, and throughput of triplexers and make it possible to be integrated with CMOS circuits.;We firstly demonstrated the first integrated 1310nm laser, which have a maximum lasing temperature of 105°C, on the hybrid silicon platform by using the direct wafer bonding technique. We also demonstrated the first integrated bulk InGaAs based PIN photodetectors on the hybrid silicon platform. In order to further integrate both of them on a silicon demultiplexer, we developed the selective area wafer bonding technique to make it possible to integrate multiple different III-V epitaxial layers on one silicon chip. With the selective area wafer bonding technique, we can integrate multiple different III-V epitaxial layers on almost any location of a host wafer, which would greatly improve the device functionalities for future applications. The developed integrated hybrid silicon triplexer has a compact size of 1mm by 3.5mm and its performance satisfies the ITU standards. It also shows great potential to be integrated with CMOS circuits for future applications.
Keywords/Search Tags:Integrated, Triplexer, Hybrid silicon, Wafer bonding technique, Data
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