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Study On The Front-End Electronics Test Platform For Atlas Phase-? Upgrade

Posted on:2018-10-25Degree:DoctorType:Dissertation
Country:ChinaCandidate:H B LiuFull Text:PDF
GTID:1310330512485571Subject:Physical Electronics
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The Large Hadron Collider(LHC)at the boarder of Switzerland and France is the world's largest particle collider,and has made numerous achievements,such as the discovery of the Higgs boson since its maiden operation in 2008.Due to the radiation damage caused by the crucial radiation environments and the expected increase on the instantaneous luminosity,the detector and electronic system will degrade and won' t be capable to maintain its physical performance.Thus,three major upgrades have been scheduled for LHC from the Phase-0 upgrade in 2013 to the Phase-? upgrade in 2023.The paper's work is mainly focused on the development of several front-end electronic test platforms for the Phase-? upgrade of the liquid argon(LAr)calorimeter and pixel detector of the ATLAS detector in LHC.The upgrade of the internal tracking detector is one of the most important contents of the ATLAS detector Phase-? upgrade,which will likely use the high voltage CMOS(HV-CMOS)process as one of its candidate sensor technology,and the corresponding R&D work is carried out extensively.In order to verify that sensors made in HV-CMOS process can meet the requirements of phase-? upgrades of the pixel detector in the im-portant parameters of detection efficiency before and after a certain amount of radiation damage,it is necessary to perform lots of electronic tests and beam tests to verify its re-liability.For this test demand,this paper designed a modular pixel sensor testbeam test platform based on the FELIX(Front-End Link eXchange)concept as its testbeam data acquisition system.This test platform has been deployed for the test of the pixel sensors fabricated by the AMS(Austria Mikro Systeme)180nm HV-CMOS process,and some essential specifications(e.g.detection efficiency and time response)for the AMS180vx series pixel prototype sensors have been confirmed for the first time.In addition,this test platform has been used for the test of the large-scale verification sensor fabricated by the AMS 350nm HV-CMOS process since Sep.2016.The liquid argon calorimeter of ATLAS will use the new front-end electronic board(FEB-2)in the Phase-? upgrade,and the research of the radiation-hardened ADC is an important part of the design and manufacture of FEB-2.While designing the corre-sponding radiation-hardened ADC ASICs,it is necessary to select a commercial ADC that can be validated by irradiation test as its backup chip.A test platform for the char-acterization of the radiation tolerance performance of the commercial multi-channel high-speed ADCs has been designed.At present,the ADC characterization has been used for the irradiation test of the first batch of commercial multi-channel ADC,Texas Instruments ADS52J90 and ADI's AD9249.The total dose-effect(TID)test was con-ducted in the solid-state gamma irradiation facility at the Brookhaven National Labo-ratory,where the radiation source is a 60Co gamma source with a radioactivity of 700 Curie,the dose rate for the ADC irradiation test was set to around 10 kRad(Si)per hour;the single event effect(SEE)test was carried out in the proton therapy center in the Massachusetts General Hospital,where the energy of the proton beam was set to 216 MeV during the SEE test.The results of the irradiation tests verified the versatility and reliability of this ADC radiation tolerance performance characterization platform.And the radiation tolerance specification for this two commercial ADCs were determined for the first time.In addition,a FE-SOC(front-end system on chip)to integrate various modules such as preamplifier,shaper and ADC etc.into one chip has been proposed for the FEB-2.At the present,multiple parallel development of different modules for FE-SOC have been carried out in several constitutions,and the HLC1 is a 8 channels pre-amp ASIC with shaper designed by BNL while the LAUROC is a 8 channel pre-amp ASIC designed by LAL/Omega group.Aiming at the testing requirements of these two multi-channel pre-amp ASICs,a common test stand for electronic and irradiation test of these two front-end ASIC chips has been designed.The test results of this test stand show that it is capable for performing the electronic and irradiation test of HLC1 and LAUROC.The primary innovations of this thesis are as follows.1)Designed a testbeam system that could configure and tune the pixel sensor and test,could control and readout the pixel readout chip FE-I4B,and could readout the whole FE-I4 telescope testbeam platform at the same time.By the helping of this pixel sensor test platform,some essential specifications of the pixel sensors manufactured by the AMS 180nm HV-CMOS process have been confirmed for the first time,which had pushed the process of the design of the large scale HV-CMOS pixel sensors fabricated by the AMS 180nm HV-CMOS technology.2)New data acquisition scheme is employed during the test beam.The utilization of the ATLAS FELIX(Front-End Link eXchange)system as the data acquisition for the pixel sensor beam test platform push the upper limit of the data bandwidth from the sub-Gbps(GbE and USB)to the 100 Gbps(4.8 Gbps x 24 Links)range.3)The radiation tolerance characterization system for the described in this paper confirms the two latest multi-channel ADCs(ADS 52J90 from Texas Instruments and AD9249 from Analog Devices)for the LAr calorimeter Phase-II upgrade.
Keywords/Search Tags:front-end electronics, HVCMOS pixel detector, pixel detector testbeam, ADC irradiation test
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