3D ICs Placement Alogrithm Based On Nonlinear Programming

The rapid development of the integrated circuits makes the increasement of chip intergrationand scale sharply. In order to reduce interconnect delay and improve the performance of the circuitfurther, the concept of the “Three-dimensional Integrated Circuits(3D ICs)” has been presented inintegrated circuit design and manufacturing process.3D ICs not only bring momentum to thedevelopment of the integrated circuits, but also bring huge challenges to the integrated circuitphysical design and design tools.This paper has taken research on global placement algorithms, especially on nonlinearprogramming methods. Based on the3D ICs structural features, a new wirelength-diven3Dplacement algorithm is proposed in this paper, which resulted in a close-to-legal3D globalplacement. It composes of a series of new techniques includeing a new dyadic cluster approach; awire-length driven legalization algorithm; a layer assignment method using the minimum costflow. Experiments showed that the algorithm could effectively solve the issues of large-scale3DICs placement problems.